October 15th

Rev 1.0e Design updates:

• Minor layout and dcdc power updates
• Final main board PCB’s expected by November 13th 2026

September 22nd

Rev 1.0d Design updates:

• Finalized pcb edgecuts for final production

Rev 1.0c Design updates:

• Fixed bug with charge circuit
• Updated power protection circuit

August 31st

Rev 1.0b boards ordered for final circuit verification

August 26th

Rev 1.0b Design updates:

Latching Circuit

• Battery power supervisor latching circuit to prevent power cycling when battery is depleted.
• Supervisor circuit will latch system off if power switch is left on an voltage dips below safety threshold.
• Fixes old gameboy bug that was less of a problem when disposable batteries were used.

Re-located battery and audio connections

• Allows for the battery and speaker to get installed after the module is installed.

RAM chip footprint update

• Updated RAM chip footprint width to improve RAM integration step.

Lego Build Updates:

• Battery cover is no longer 3D printed but uses parts from the stock Lego Gameboy build.
• Wire routing cleanup.
• Battery compartment updates.
• Speaker re-located to stock Lego Gameboy build speaker location (mimics the actual speaker location of an actual gameboy).
• New cartridge slot cover.

Sub Board Updates:

• New screen brightness and color control rocker switch
  • This change adds a rocker switch in the contrast wheel location to allow for on the fly screen brightness and color change. Previously this was only possible if game was removed and the user tapped at the top of the device above the game cartridge slot.
• Updated connectors on the super pad and start select pad
• New power switch sub board to remove soldering step of having to solder the power switch in place. Allows for quick swapping of the power switch and reduces assembly error.

August 5th 2026

• Board bring up and testing
• Identified pinout bug on A B button pad. Reworked board to fully test fix. Revision made and new boards ordered.
• Build documentation created and currently refining build steps.

July 3rd 2026

• Received manufacturing status update from manufacturer.
• Reviewed boards and communicated to manufacturer to proceed with finalizing production.

June 19th 2026

• Production main motherboard sent out to PCBway – Rev 1.0a
  • easier to assemble sub board components with Molex connectors
  • fixes ground plane issue
  • removed button hardware diodes from main board
• New sub pcb board designs sent out to JLC PCB
  • Usb C PCB
  • D pad PCB
  • Start/ Select pad PCB
  • A and B super distribution pad PCB
  • Volume Wheel PCB

Whats next?

Expected delivery of new PCB components is early July. Next I’ll be testing and performing verification of the new motherboard and sub components. I’ll be testing PCB functionality as well as another Lego Boy build to tweak the build process. The goal is to streamline build and also document the build steps in further detail with the new sub board architecture.

March 10th 2026

• V0.0.1 boards recieved
• MGB CPU and RAM transplanted and board tested
• Design bug with main power feed not getting to the CPU :/
• Design bug with missing audio amplifier limiting resistors